『海報』The Smart-Bump COG NCF Process for LCD Packages

『Display My Life, Light Up My Future』系列專題演講之七

講者：楊界雄博士

            SID Fellow, Professor at NCTU

講題：The Smart-Bump COG NCF Process for LCD Packages

時間：5/15(五) 1:30–3:00  

            交映樓201教室

A novel innovative Smart-bump structure has been successfully developed for chip-on-glass (COG) package using non-conductive adhesive film (NCF). We have successfully verified the low connect resistance and high reliabilities using Smart bump and COG NCF process for the packages of 17”W TFT-LCD modules. We have proved that COG NCF process with Smart bump has lower costs in consumable materials and driver ICs, and simpler than the conventional COG ACF process with Au bump. Further more, the COG NCF process also allows finer-pitch-driver package for high-resolution TFT-LCDs, and has a higher process yield in production.

We believe that our Smart-bump designs and COG NCF process will replace conventional Au-bump COG ACF process that has been invented and dominated by Japanese industries, and heavily used in the LCD packages for past quarter century.

檔案下載：楊界雄演講海報